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Inspection and Failure Analysis System
The NXR-1510 is a new full-featured, automatic X-ray inspection and quality assurance test system. It features three-axis rotation through 360 degrees, ability to handle boards up to 18 x 24 inches, a high-resolution 100 k X-ray source and 65x image magnification. It has image analysis tools for enhanced measurement capabilities including drill offset, diameter, moment ratio, elliptical pattern, solder density ranges, threshold library, percent voiding, auto-void count, die attach voiding and wire sweep. It is designed to provide entry-level inspection for contract manufacturers and electronic OEMs, especially SMT boards using BGAs, flip chips, µBGAs and other high-density packages. Nicolet Imaging Systems, San Diego, Calif.
Handling and Inspection Machine
Ismeca introduces the MP400T, the latest addition to its MP series of component handling and inspection machines. The new system adds electrical testing and laser marking to the MP400 mid-volume, tray-to-tape and tray- to-tray platform. The system provides true three-dimensional lead/ball coplanarity inspection and mark inspection on BGAs, CSPs, and other two- or four-sided components. Available options are a laser to mark the components during processing and a feature that allows the parts to be electrically tested before final packaging. Ismeca, Vista, Calif.
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Oscillators
Vishay Intertechnology's new pair of clock oscillators feature a 3.3-V input and a 1- to 70-MHz range. They also feature TTL and HCMOS compatibility and a tri-state feature that allows the output to be placed into high-impedance state. Standard and industrial temperature ranges are available with two through-hole hermetically sealed package options: 14-pin DIP and half-size 8-pin DIP. Input currents for the oscillators range from 10 to 30 mA, with rise and fall times of 10 ns maximum. A ±100 ppm frequency stability over operating temperature range is standard, with ±25 and ±50 ppm available. The new oscillators will provide clock signal sources for digital ICs and microprocessors in low-power applications, such as computers, portable peripherals and communications equipment. Vishay Intertechnology, Malvern, Pa.
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Laser Marking System
Unitek Miyachi Lasers has introduced the Class 4 system that is well-suited for oversized applications and developmental work. It features an adjustable Z-axis rack and pinion linear motion guide and a large 16 x 16-in. worktable, allowing easy access to oversized parts. It is capable of permanently marking metals, plastics, semiconductors and ceramics. Its Windows-based software can create, edit and execute both simple and complex marking programs. The system can also accept up to seven marking schedules, 24 standard bar codes and 23 graphic files. Unitek Miyachi Lasers, Monrovia, Calif.
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Curing System
The CoolCureXL system, RC-747, is a UV pulsed curing system that reportedly provides deep penetration cures without any heat-induced damage to substrates. It delivers high peak, broadband light free of damage from thermal stress. It has a spiral-shaped pulsed lamp, optimized with synchronous high-speed electronic pulses. This system is useful in many fields, such as flat panel displays, printing, semiconductors and film coatings. It is a non-toxic, mercury-free operation. Xenon, Woburn, Mass.
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Solder Paste Printer
The Panasert SPF Super Print solder paste ma chine delivers fast printing speed and cycle- times as low as 8 seconds per board. It uses an open-type, high-speed squeegee head de signed to maximize speed up to 220 millimeters per second and improve solder paste printing time. It delivers accurate printing for components from 0603 microchips to 0.3-mm pitch QFPs and 0.5-mm CSPs. It also uses a high-speed vacuum to remove solder paste from the underside of the screen mask preventing clogs from forming in the opening. Panasonic Factory Automation Company, Franklin Park, Ill.
Media Transfer System
The ST-595-2 fully automated media transfer system combines fast changeover with high throughput, offering safe, reliable high-speed handling of QFP, TSOP, LCC, BGA, CSP and similar devices. A full range of vision inspection capabilities is said to ensure high quality and eliminate product defects for end-of-line production. Features include software that eliminates the need for application-specific tooling and adjustments during changeover and requires no camera recalibration. Parallel device handling enhances throughput. Two pick-and-place heads can rotate 90, 180 and 270 degrees. The system may also be configured for tray-to-tape or tray-to-tray operation. RVSI, Canton, Mass.
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Temperature Sensor
The Temprobe has been developed for use in lead-free soldering, where peak temperatures can reach 275°C. It is a precision temperature-sensing tool that can be placed anywhere a temperature reading is required, even in solder paste. It will plug directly into any standard type “K” thermocouple profiler or readout device. The Temprobe maintains high-contact pressure on the thermocouple to ensure accurate, repeatable readings. Saunders Technology Inc., Hollis, N.H.
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Photoetching
The photoetching process allows Tech-Etch to produce intricate components that cannot be duplicated by other production methods. Custom light-gauge parts can be manufactured with intricate patterns, precise tolerances and burr-free edges with exact repeatability. Metals, such as beryllium copper, stainless steel, aluminum, titanium, molybdenum, brass and spring steels, as well as polyimide film for flexible circuits, can be etched. Parts can be as thin as 0.005 inches. Special processes, such as assembly and finishing, are also available. Tech-Etch, Plymouth, Mass.
Wafer Stepper
The Saturn Spectrum 300 offers 300-mm lithography capabilities to customers in the flip-chip (bump) processing arena. The system's introduction is timed to coincide with chipmakers' current transition to larger-diameter wafer processing and is said to offer a new breed of stepper to accommodate the intricate packaging requirements of highly specialized bump applications. It builds on Ultratech Stepper's 1X lithography system with a broadband lens that allows for automatic selection of exposure spectrum (i-line, gh-line or ghi-line). The tool reportedly has a low numerical aperture lens design. Ultratech Stepper Inc., San Jose, Calif.
Integrated Fabless Solutions
Integrated Fabless Solutions is a set of integrated services delivered across the silicon cycle, including test strategy consulting; silicon validation and characterization; silicon debug and repair; integrated test solutions; remote collaboration; deployment to high-volume manufacturing; and education program planning and consulting. These services, combined with Schlumberger's Technology Centers, are said to enable fabless customers to reduce engineering cycle time and move devices to high-volume manufacturing more quickly. Schlumberger Advanced Business Engineering Resources (SABER), a unit of Schlumberger Limited, San Jose, Calif.
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Proximity Mask Aligner
The Reel-to-Reel Proximity Mask Aligner is for volume production of tape for tape carrier packages (TCP) and flex-based CSPs, like the µBGA. The tool, called the MA100RR, can reportedly also be used for products requiring very fine patterns on flexible materials, such as flex-based displays. It is said to offer high resolution of better than 5 µm that is achieved by distortion-free proximity printing, even on wide foils. Karl Suss, Munich, Germany.
Laser Tray Marking System
The U-1481 system is a new laser tray marking system designed to mark semiconductor components. Designed for hand loading with a left-to-right feed, the system is said to offer a suitable solution for applications with small lots and frequent changeovers. It uses Markem's 3000 Series direct laser to mark semiconductor units in a JEDEC tray and features the ability to be loaded and unloaded during the marking cycle for greater throughput. Markem Corp., Keene, N.H.
Thermal Interface Compound
The TIC-7500 Thermal Interface Com pound is designed to meet the demand for a next- generation interface material that provides the low thermal resistance mandatory for increasingly faster and hotter microprocessors. Real-time comparative tests reportedly show that this product will deliver less thermal resistance than silicone grease on 950 MHz and 1 GHz chips, with a thermal conductivity of 7.5 W/m-K. With this compound, computer makers can use the fastest chips without the penalty of adding evaporators, bigger fans or channeled air flow for extra cooling. The Bergquist Co., Minneapolis, Minn.
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Surface Mount Inductor
The high-performance DR339-X Series inductors are designed for DC-DC converter and switching power supply applications. With an inductance range from 0.47 to 100 µH and a rated current from 19.0 to 0.47 A, this product is said to be suitable for use in computers, tele communications, medical devices, instrumentation and more. The DCR value is 0.0097 to 1.1090 Ω. The compact series reportedly features a low-profile, flat-top, circular design available in tape-and-reel packaging that is suitable for automated pick-and-place manufacturing. Datatronics Romoland, Romoland, Calif.
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Bus Frame Grabber
The PCVisionplus is a new half-slot PCI bus frame grabber designed for high-speed inspection applications. Said to be able to digitize monochrome analog video at ultra-high frequencies of up to 53 MHz, it features 4 MB of on-board memory and hardware ” scatter gather” that supports fully automated image transfers from image memory. The product is based on an “all-in-one” design that combines a high-performance frame grabber, support for a range of standard and nonstandard cameras and OPTO-22- compatible digital I/O to control external events. Imaging Technology Inc., Bedford, Mass.
AP
