Pentagon opens fifth semiconductor parts reconditioning facility

Fremont, California–Nov. 21, 2000–Pentagon Technologies, Inc. is opening a fifth semiconductor parts cleaning and reconditioning facility in Portland, Oregon to meet the demands of advanced wafer fabrication equipment requirements–focusing on cleaning and reconditioning parts and assemblies used for 200mm and 300mm wafers, sub-180nm fabrication techniques, and copper interconnect processing. The 30,000-sq-ft site is set to be operational during May of 2001, serving the greater Pacific Northwest and Rocky Mountain region.

“We are the largest supplier in the world for parts reconditioning services, and our customers need local support. Pentagon is building the team and infrastructure to be a complete supplier to the integrated circuit industry,” says Frank McBride, president of Pentagon. “Now, our Pacific Northwest customers will be able to focus upon optimization of overall fab efficiency through outsourcing–eliminating the need for “in house” facilities within their wafer fabrication operations. Establishing the Portland operation is another key step in ensuring that we offer coast-to-coast customer satisfaction.”

The new facility will provide end-to-end parts cleaning and reconditioning services, according to Pentagon, using leading edge defect reduction technologies such as twin wire arc spraying and surface particle detection and reduction.


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