Hsinchu, Taiwan–Nov. 15, 2000–Taiwan Semiconductor Manufacturing Co. (TSMC) has developed what is believed to be the industry’s first comprehensive 0.13-micron, mixed-signal/radio frequency (RF) test chip. The new chip is expected to help TSMC create characterization reports and other elements of the 0.13-micron, mixed-signal/RF design kit.
“Our 0.13-micron, mixed-signal/RF test chip targets the industry’s most advanced communications designs,” says David Sheng, director of advanced technology product marketing at TSMC. “The new test chip and design kit take the guesswork out of the design process. This increases the chances for right-the-first-time design success and shrinks the concept-to-silicon cycle dramatically.”
The test chip is scheduled to enter production in the fourth quarter of 2001, according to TSMC, enabling companies to accommodate higher levels of complexity in a smaller space for system-on-chip (SOC) RF designs–while achieving higher frequencies at a lower cost. TSMC reports that the chip may help companies accelerate higher bandwidth designs, including Bluetooth and SONET-based communications and consumer products.