Hsinchu, Taiwan–Nov. 16, 2000–Taiwan Semiconductor Manufacturing Co. (TSMC) has begun processing 300mm wafers on its Fab 6 pilot line.

“TSMC’s current 200mm manufacturing equipment is reaching its theoretical limits in terms of yield and throughput,” says Dr. F.C. Tseng, TSMC president. “The move to 300mm manufacturing opens up more room for improvement, ultimately resulting in higher yields, higher volumes, and higher product quality for our customers.”

TSMC’s 300mm manufacturing technology production ramp began with the construction of Fab 6, the world’s largest IC manufacturing facility. The 300mm pilot line, which will produce wafers based on the company’s 0.18-, 0.15-, and 0.13-micron technology, is capable of producing about 4,500 wafers per month when in full use next year, according to TSMC.