Infineon to produce 300mm wafers in Virginia

Munich, Germany–Infineon Technologies AG today announced plans to increase production capacity of ICs at its Richmond, Virginia fab. The company will outfit the new module, currently under construction, with 300mm equipment.

“Infineon will equip the fab step by step in accordance with the demand of our customers,” says Infineon Chief Operating Officer Dr. Andreas von Zitzewitz.

Leading-edge memory chips currently manufactured on the 200mm line at Infineon Technologies Richmond will move to the 300mm line, making existing capacity available for the production of communications ICs.

The new module is scheduled to begin operations at the end of the first quarter of 2002, and initially will produce 256 Megabit DRAM ICs using 0.14-micron technology, with an expected fast transition to next-generation devices.

Infineon expects the new module to create more than 1,100 job opportunities at the Richmond plant.


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