Santa Clara, California–Intel Corp. announced today that its new wafer fab, currently under construction in Leixlip, Ireland, will begin production in 2002 using state-of-the-art 300mm technology. The project, first announced in June of this year, originally was planned as a 200mm fab. The new fab, known as Fab 24, will be Intel’s second facility dedicated to 300mm, and is expected to be the first high-volume 300mm fab in Europe.
“The addition of a second 300mm production fab to our factory roadmap will significantly improve our asset utilization and improve our production capacity for future generations of products,” says Mike Splinter, executive vice president and general manager, Technology Manufacturing Group. “These new 300mm fabs will feature advanced automation systems to significantly improve productivity and yields.”
Fab 24 will include 135,000-sq-ft of cleanroom and manufacturing space.