Midland, Michigan–Dow Corning has announced International SEMATECH’s successful integration of its XLK Spin-On Dielectric–a next-generation, low-k film–in a double-level metal copper damascene test structure. Following the evaluation of XLK in one-level copper damascene stacks, this work represents further development of the integration process to fabricate double-level copper damascene 0.25-micron via chain structures, according to Dow Corning.

“Of all of the technology challenges facing the industry, the transition to low-k materials is proving to be one of the most difficult,” reports Paul Wineberger, director of Interconnect at International SEMATECH. “Our work with Dow Corning and other materials suppliers is part of International SEMATECH’s ongoing effort to provide early learning for our members by identifying, characterizing, and integrating leading-candidate, low-k materials for future semiconductor devices.”

XLK is a next-generation, low-k film based on HSQ resin found in Flowable Oxide (FOx), one of the largest-selling, low-k spin-on dielectrics on the market. Dow Corning worked to optimize XLK’s ability to endure etch, CMP, ash, and clean processes in the ISMT process flow, while minimizing chemical and mechanical damage to the film.