Chiba, Japan–Rodel, Inc. recently introduced the SPM3100 polishing pad, the newest product in its line of silicon and substrates polishing solutions. The SPM3100 pad was developed for use in the final polish step of silicon wafers and alternative substrates, such as gallium arsenide (GaAs) and indium phosphide (InP).

“Unlike competitive offerings, the SPM3100 reduces break-in times, allowing users to polish production wafers immediately after installation, thereby increasing tool uptime. Most important, the pad enables wafer manufacturers to substantially expand productivity without adding more capital equipment,” says Dan Koharko, vice president and general manager of Rodel’s Substrates/Storage/Optoelectronics business unit.

The SPM3100 is an advanced poromeric pad that offers repeatable physical properties by design, according to Rodel. Property variation is a common problem for poromeric pads coated on felt substrates–the traditional type of pad used in final polishing applications. The SPM3100’s proprietary pore structure, which is grown directly on Mylar to reduce physical property variation, was optimized in Rodel’s Material Development Center. The pore structure provides the necessary balance between pad compressibility and hardness, providing low nano-scratch levels, light point defects, (LPD’s) and haze, reports the company, while maintaining the wafer’s geometry. The optimized pore structure and repeatable physical properties are designed to ensure consistent performance from the first run after installation, increasing tool uptime and lowering the cost of ownership.

“The SPM3100 is a demonstration of the capabilities of our new Materials Development Center. Being able to replicate our customers’ processes and results in a fab environment has allowed Rodel to bring complete process solutions to the industry, not just new products,” says Tony Khouri, president and chief executive officer of Rodel.