TSMC delivers 0.13-micron processor wafers to VIA

Hsinchu, Taiwan–Taiwan Semiconductor Manufacturing Co. (TSMC) announced yesterday the delivery of 0.13-micron functioning wafers to VIA Technologies, Inc., a leading fabless semiconductor design house. The 0.13-micron functioning wafers are a foundry industry first, TSMC believes.

VIA’s new Cyrix processors were developed using TSMC’s 0.13-micron CL013LV process, which features advanced technology for high-performance, high-density designs. VIA expects the process to significantly enhance both the performance and power efficiency of if its processor designs. “TSMC has clearly demonstrated that it is ahead of the curve with its state-of-the-art process technology,” says Wenchi Chen, president and CEO of VIA. “Through our close partnership with them, VIA will be the first company in the world to launch a CPU using an advanced 0.13-micron process onto the market.”

TSMC’s complete 0.13-micron process technology family includes core (CL013G), low power (CL013LP), and high performance (CL013LV) choices.


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