Chandler, Arizona–Amkor Technology, Inc. is planning to open a semiconductor assembly and test manufacturing facility in China to provide packaged IC components for the Chinese cell phone, PC, and laptop markets. The factory, located in the Waigaogiao Free Trade Zone in Pudong, Shanghai, is expected to deliver its first products during the third quarter of 2001.

“Following the acquisition of the K1, 2, and 3 factories last year, we have been focused on capitalizing on key strategic opportunities,” says James Kim, Amkor’s chairman and chief executive officer. “Our landmark transaction with Toshiba opened up the market for captive assembly and test in Japan. Now with this move into China, we recognize the increasing role China plays in the global electronics industry. We believe that having infrastructure in this rapidly growing market will help Amkor maintain our position as the world leader in contract microelectronics manufacturing.”

Amkor will install equipment from its manufacturing facilities in Korea and the Philippines into a newly built shell facility to reach early production goals. The company initially will use experienced engineers and technicians from its existing facilities to ensure a rapid startup and to train locally hired staff for continuing operations.

The 115,000-sq.-ft. facility will initially produce components for baseband processors and controllers, but will be expanded to include components for other telecom and computer products produced by Amkor customers with regional operations in China. These IC packages include components for SRAM and flash memory, power controllers, RF power amplifiers, and graphic chipsets, among others.