Amkor working on ‘green’ halide-free IC packages

Chanler, Arizona–In response to worldwide environmental concerns, Amkor Technologies is working to complete qualification of halide-free IC packages early this year. The company is replacing minute amounts of halides, commonly used as a fire retardant in IC components, with environmentally safe alternatives such as magnesium oxide.

Amkor’s qualification of halide-free materials used in the assembly of laminate- and tape-based ball grid array (BGA) packages follows their introduction last year of lead-free BGA and leadframe IC packages.


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