Santa Clara, California–GEM Services, Inc., a multinational semiconductor assembly and test service provider specializing in power semiconductor packages and modules, recently opened an assembly and test facility in China’s Shanghai Jiading Industrial Zone and now plans to invest $40 million to equip the facility. The company expects the new 30,000-sq.-ft. building to reach full production capacity of 1.1 billion units per year by the end of 2001.
“We believe that this facility has the lowest cost structure for power packages of any outsourcing manufacturing facility in the world,” says R.J. Kulle, GEM’s president and chief executive officer. “Our team’s previous success and well-developed skill set in China and Asia Pacific provides much added value for our customers.”
The operation will initially assemble and test DPAK, SO-8, and TSSOP-8 packages. Additional packages currently under consideration include the SOT-23, SOT-223, and TSOP-6, derivatives of TSOP-6, and other advanced, small footprint, surface-mount packages.
GEM has also constructed a second factory building at the Jiading site, where production will begin during the second quarter of 2001.