High-speed transceiver solution available from TI

Dallas, Texas–A fully-integrated, multi-rate low-power CMOS transmitter/receiver solution for SONET/SDH optical modules with transmission rates up to OC-48 is now available from Texas Instruments Inc. (TI).

TI’s new high-speed transceiver solution reduces space and cuts power consumption in half over comparable, less-integrated devices, according to the company, as well as offering greater design flexibility and outstanding performance. The new device will reduce costs, improve reliability, and speed time to market for manufacturers of the optical modules used in SONET/SDH and optical networking equipment.

The SONET/SDH transceiver supports bi-directional OC-48, -24, -12 and -3 transmission, as well as integrating the multiplexing and demultiplexing (mux/demux), clock/data recovery (CDR), and clock generation functions used in optical modules. The CMOS process on which the SLK2501 is based provides operating characteristics that meet or exceed all SONET/SDH jitter requirements. The process also reduces power consumption to a mere 650mW during OC-48 operation. Unlike solutions based on non-CMOS processes, the SLK2501 is characterized for the industrial temperature range of -40 to 85 degrees C and requires no special cooling arrangements.

Operating from a single 2.5-V supply, the SLK2501 is built for ease and versatility of design. A high-speed low-voltage pseudoemitter-coupled logic (LV-PECL) serial interface on the fiber side and a 4-bit low-voltage differential signal (LVDS) interface (OIF1999.102 SFI-4 compliant) on the host side facilitate system design. Dual reference clock support at 155- and 625-MHz and autorate detection for data transmission provide application flexibility. Testability features such as on-chip pseudorandom bit stream (PRBS) generation and verification and parity checking and generation for the LVDS interface serve to enhance system reliability.

TI’s SLK2501 transceiver is sampling now, with volume production scheduled for the first quarter of 2001. To aid in design, an evaluation module is also now available. The device is packaged in a low-profile 100-pin very thin quad flatpack (VQFP) with PowerPad for thermal performance. Planned pricing in volume is $140 per unit in quantities of 1,000 units.


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