Willow Grove, Pennsylvania–Kulicke & Soffa Industries Inc. and its Flip Chip Technologies, LLC (FCT) joint venture today announced that National Semiconductor Corp., Santa Clara, CA, has signed a license for FCT’s wafer bumping technology.
National Semiconductor will use FCT’s Flex-on-Cap (FOC) wafer bumping and redistribution (RDL) technologies to manufacture wafer-level chip scale packages and other products that enable design engineers to develop compact, high-performance systems. FCT will continue to produce bumped wafers for National Semiconductor at its Phoenix, AZ facility.
“The technology transfer will allow us to meet increasing capacity requirements for new chip scale packages, continuing National Semiconductor’s leadership in providing solutions for form factor driven applications,” says Kamal Aggarwal, National Semiconductor’s executive vice president.
Wafer bumping and redistribution are silicon wafer processes required for most flip chip packaging applications. These key enabling technologies are the foundation of any flip chip and true wafer scale package manufacturing capability. FCT’s process has been in production at its Phoenix facility since 1997.