Billerica, Massachusetts–PRI Automation, Inc., a global leader in semiconductor factory automation systems and software, has announced TransFab, a unified material handling system (UMHS) capable of providing fab-wide tool-to-tool wafer delivery in 300mm fabs.
The TransFab unified material handling system makes direct tool-to-tool wafer transport faster and more efficient by combining interbay and intrabay transport into one seamless solution. The TransFab unified material handling system offers extremely flexible configurations allowing semiconductor manufacturers the opportunity to configure a TransFab solution that meets their requirements.
“The transition to 300mm manufacturing means semiconductor manufacturers will be facing new integration challenges as they ramp up to full production over the next few years,” says Mitch Tyson, president and chief executive officer of PRI Automation. “300mm production fabs will be highly automated manufacturing environments where work-in-process wafers will be transported directly from tool to tool. TransFab is an ideal solution that gives manufacturers the migration path they need to implement a fab-wide unified material handling system as they gain familiarity and confidence in automating more of their manufacturing logistics.”
With its advanced AeroLoader transport system and robust TransNet software suite, PRI Automation reports that TransFab responds instantly to fab priorities for fast hot lot delivery, accommodates 300mm fab flexibility demands and implementation preferences, and ensures dependable performance for fully automated environments.