QUALCOMM invests in ChipPac’s assembly and test operations in China

San Diego, California–QUALCOMM Inc. has invested $25 million in ChipPac, Inc. and signed an agreement with the company for supply and test services for its mobile station modem (MSM) ICs. The investment, which was finalized in August 2000, combined with ChipPac’s recent announcement of direct sales in China, allows QUALCOMM to assemble and test its chips in China for future Chinese customers, and ensures capacity availability for semiconductor production in China.

“China represents one of the fastest growing and most lucrative semiconductor markets in the world,” says Dennis McKenna, chief executive officer and president of ChipPac. “Our relationship with QUALCOMM will enhance our growth and expansion into this strategic market and lay the groundwork for offering Chinese consumers advanced Code Division Multiple Access (CDMA) wireless products.”

ChipPac, of Santa Clara, CA, is one of the largest independent suppliers of high-end test and packaging solutions.

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