TSMC delivers Bluetooth wafers to Zeevo

Santa Clara, California–Zeevo Inc. today announced that it has received highly integrated, single-chip Bluetooth silicon from Tawain Semiconductor Manufacturing Co. (TSMC). TSMC produced the Bluetooth wafers, which reportedly pack RF, analog, and digital baseband functionality into one integrated device, using its advanced 0.18-micron mixed-signal CMOS process.

“This new chip sets a new industry standard for integrated Bluetooth silicon,” says Greg Ravenscroft, Zeevo’s vice president of Marketing. “All RF components are integrated on-chip. We have the fewest external components in the industry, which drives down the real cost of product, reduces risk, and speeds design times. We offer our customers a complete single-chip solution with software and application profiles, resulting in one-stop-shopping for a complete Bluetooth solution.”

Zeevo expects to announce its Bluetooth solution, which includes the device plus full software and development support, during the first quarter of 2001.


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