Amkor files packaging patent infringement suit against STATS

February 21, 2001–Amkor Technology has filed a packaging patent infringement suit against ST Assembly Test Services, Inc. in Milpitas, CA, and ST Assembly Test Services Ltd. in Singapore. In its suit, Amkor alleges that STATS infringes its U.S. Patent No. 6,143,981 by making, selling, offering for sale, or importation into the U.S. the Quad Leadless Package, which Amkor says infringes one or more of the 19 separate MicroLeadFrame packaging technology claims in the ‘981 patent.

“Amkor has invested heavily in research and development for semiconductor packaging technology and has placed an emphasis on expanding its intellectual property portfolio in recent years,” says John Boruch, president of Amkor. “Amkor is acting to protect the interests of its employees, shareholders, and the investment community by bringing the federal lawsuit against STATS. We will protect our property.”

STATS responded to the charges, stating that the company finds the lawsuit to be without merit.


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