February 21, 2001–BOC Edwards Kachina is nearing completion of a state-of-the-art semiconductor component cleaning facility in Hillsboro, OR. The 22,000-sq-ft facility will be the third full service BOC Edwards Kachina operation in the U.S., providing chipmakers with a range of cleaning processes, component management, and support services. The facility is scheduled to become operational in May.
“We are working with our existing customers in the Pacific Northwest to provide proprietary cleaning processes that meet today’s exacting technology standards,” says Mark Rosenzweig, chief executive of BOC Edwards, Americas. “This expansion supports our overall growth strategy of establishing BOC Edwards’ service and technical support near semiconductor manufacturing facilities in every region of the world.”