Boin, TePla sign OEM agreement

February 12, 2001–Tomerdingen, Germany–Boin GmbH, a metrology software manufacturer for the semiconductor industry, has entered into an OEM agreement with TePla AG, a manufacturer of metrology tools and low pressure plasma systems. TePla will use Boin’s WAFERMAP metrology software on its TWIN SC measurement tool to support the visualization and interpretation of measurement results.

“We are very proud to announce the cooperation with TePla AG,” says Dr. Manuela Boin, co-founder and general manager of Boin. “We are now close to the 10th customer milestone for OEM usage of WAFERMAP on metrology tools within the semiconductor industry. Our decision in early 1999 to focus on this market segment has proven successful. We are discussing OEM licensing agreements with a number of other metrology equipment manufacturers in the U.S., Europe, and Asia. Our goal is to set the standard for visualization of metrology data within the industry.”


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