Frankfurt (Oder), Germany–Communicant Semiconductor Technologies AG, launched yesterday in Germany, has announced its intention to build a $1.5 billion “pure-play” IC foundry in Frankfurt (Oder), located 50 miles east of Berlin, to serve Europe’s wireless, broadband, and high-performance markets. Intel Corp. and IHP, a Frankfurt (Oder)-based microelectronics R&D center, are strategic investors in the foundry and have signed technology-licensing agreements with Communicant.

IHP will provide high-performance silicon-germanium-carbon (SiGe:C) technology to Communicant, while Intel will provide a high-performance 0.18-micron CMOS technology. These technologies, combined with key intellectual property will enable Communicant to provide modular, high-performance SiGe:C BiCMOS and CMOS processes for the rapidly growing communications market.

“The agreements with IHP and Intel are key competitive advantages,” says Dr. Klaus Wiemer, Communicant CEO. “Our proprietary technologies and IP will position Communicant as the world’s leading communication-focused foundry serving fabless design and system houses, as well as the integrated device manufacturing community. We are perfectly positioned to play a strong role in the high-growth foundry market, with particular focus on the burgeoning communications segment.”

“We are excited to participate in this new venture with Communicant. This agreement enables Intel to gain access to foundry capacity for an important emerging technology,” says Mike Splinter, Intel executive vice president and general manager, Technology and Manufacturing group. “Communicant’s focus on SiGe:C technology uniquely positions the new company to serve the growing high performance communications semiconductor market segment.”

The Communicant fab will be operational in 3Q 2002, with production start planned for 1Q 2003. At full capacity, the facility will produce 30,000 8-in. (200mm) wafers per month. Prototyping services will be available as early as 3Q 2001.