Santa Clara, California–Intel Corp. and Siemens AG, based in Munich, Germany, today announced that they have entered into an agreement in which Intel will provide Siemens with high-performance, wireless flash memory for next-generation, Internet-ready cell phones and wireless devices.
The agreement features a 3-year commitment by Siemens to purchase more than $2 billion of Intel’s high-density, wireless flash memory devices, including advanced Intel StrataFlash memory technologies. In addition, the companies have agreed to develop new wireless devices using Intel wireless components to enable next-generation audio, video, image, and voice communications.
“Siemens is one of the world’s fastest-growing manufacturers of mobile phones, and currently occupies fourth place with a market share of about 9%,” says Rudi Lamprecht, a member of Siemens AG’s board. “By entering into the supply contract with Intel, we have ensured our ability to respond in the best possible manner to the market demand for Internet-capable, mobile devices over the next few years.”