February 26, 2001–Fort Lauderdale, Florida–Lambda Physik Inc.’s new Gator Series DPSS lasers cut and drill microfeatures in silicon at production speeds with no redeposition of material or microcracking. Its near-diffraction-limited beam quality produces small focus spot sizes to create narrow kerf widths for wafer segmentation applications, and high quality microvias under 20-microns in diameter.
A fixed short nanosecond pulse duration, along with the small focus spot size delivers peak intensities over 20 GW/cm2 (Gator 1,064nm) to drill holes with excellent circularity (both entrance and exit) through silicon wafers up to 0.75mm thick. The combination of short pulses and high peak powers minimizes material redeposition. Using shorter wavelength Gator models, such as Gator 532nm and Gator 355nm, can further optimize reduction of spattered material and microcracks.
Due to Gator’s fixed 10kHz pulse repetition rate, all laser specifications remain optimized for high speed, repeatable, deep cutting and drilling of silicon material. Full RS232 controls and an industrial-grade design deliver ‘around the clock’ production reliability that semiconductor processing demands.
The Gator Series is available in three wavelength models (1,064nm, 532nm, and 355nm).