Movers and shakers


Bo Mendoza
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Exatron Inc., San Jose, Calif., has announced the appointments of Bo Mendoza to customer relations manager, Bob Garcia to particle interconnect product manager, and Denise Smith as particle interconnect coordinator.

Bob Garcia
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Mir K. Ali has been named senior process engineer at Vitronics Soltec, Stratham, N.H.

Denise Smith
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Indium Corporation of America, Utica, N.Y., has named Wang Wei-ming field sales engineer in the People's Republic of China, and Leo M. Devine has joined the company as communications manager.

Northbrook, Ill.-based IPC (Association Connecting Electronics Industries) has appointed three new members to its board of directors. Steve Pudles is president of Nu Vision Manufacturing Inc.; Bill Beckenbaugh is senior vice president of engineering and process technology at Sanmina; and Jim Herring is president and CEO of Circuit Service Inc. All were appointed to one-year terms.

New Haven, Conn.-based Enthone (a Cookson Electronics company) has appointed C.W. Law to vice president, Asia, and Raymundo Gonzalez to general manager, South America.

Solid State Measurements Inc., Pittsburgh, Pa., has named Bud Smith vice president of sales, William J. Alexander vice president of engineering and production, William H. Howland, Jr., senior scientist and project leader, and Robert J. Hillard applications laboratory manager.

Everett Charles Technologies, Pomona, Calif., has promoted Craig Ellis to senior sales engineer.

Michael B. McShane of Motorola SPS, Austin, Texas, has received the Motorola U.S. Patent of the Year award for the patent entitled “Semiconductor Device Having a Pad Array Carrier Package.”


SolidWorks Corp., Concord, Mass., has received Machine Design Magazine's Excellence in Manufacturing Technology Achievement Award for 2000.

San Diego-based OMM Inc. has opened two new sales offices – one in Boston and the other in Munich. Bernd Runge will lead the European office, while Michael Demeo will head up East Coast operations.

Fujipoly America Corp., Kenilworth, N.J., has been awarded QS-9000 certification.

Munich-based Siemens Production and Logistics Systems has been awarded the “Partners in Performance” award by Celestica Inc. for the Siemens Siplace SMT placement systems.

The American Fine Wire business unit of Kulicke & Soffa Industries, Willow Grove, Pa., has opened a 2,880-square-meter bonding wire manufacturing facility in Kaohsiung, Taiwan.

Unitive Advanced Semiconductor Packaging, Research Triangle Park, N.C., has received ISO 9001 certification.


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