FEB. 15 Willow Grove, Pennsylvania–Kulicke & Soffa Industries Inc. and its Flip Chip Technologies, LLC (FCT) joint venture today announced that Siliconware Precision Industries Co. Ltd. has signed a license for FCT’s Ultra CSP wafer-level packaging technology. In addition, Siliconware is expanding capacity for wafers bumped with FCT’s Flex-on-Cap (FOC) wafer bumping and redistribution technologies by 80%, under a 10-year technology transfer agreement with FCT signed in December 1999.

Siliconware, one of the semiconductor industry’s largest IC assembly, packaging, and test manufacturing service companies, will use the FOC, RDL, and Ultra CSP technologies to manufacture advanced flip chip and wafer level packages at its Taichung, Taiwan assembly facilities.

“We are adding capacity as quickly as possible to meet our customers’ requirements,” says Siliconware Senior Vice President C.Y. Lin. “FCT’s technology has demonstrated the ability to quickly ramp high-yield processes to manufacture flip chip and wafer level packages. In addition, minimal time and capital investment will be required to integrate Ultra CSP capability with our existing equipment set and process flow.”

FCT’s Ultra CSP is a wafer-level chip size package that does not require an interposer or underfill, making it a low-cost CSP solution. Wafer bumping and redistribution are silicon wafer processes required for most flip chip packaging applications. These key enabling technologies are the foundation of any flip chip manufacturing capability. FCT’s FOC and RDL technologies have been in production at its Phoenix facility since 1997.