Silterra delivers 0.22-micron wafers

FEB. 14 Kulim, Malaysia–Silterra Malaysia Sdn. Bhd., a full-service semiconductor manufacturing provider, today announced that it has successfully produced fully functional, high-yielding product wafers in its CMOS22, 0.22-micron process technology. The wafers were delivered to one of Silterra’s strategic customers last month.

The product integrates both logic and analog circuits, which require extremely tight process control, in the 5-layer metal CMOS process.

“We went from equipment qualification to delivering working products to our first two customers in just 2months,” says Cy Hannon, CEO of Silterra. “We have demonstrated our ability to deliver leading-edge products to customers in record time. Our strategy is to provide high-quality products and top-notch service with very quick turn-around time.”

Silterra’s latest success came only weeks after it had shipped its first product wafers at the beginning of January 2001. The first customer product was a very complex design, measuring more than 210 square millimeters and was fabricated on the 0.25-micron CMOS25 process with 5 layers of metal.

Silterra’s first wafer fab became operational in the fourth quarter of 2000. Volume production has begun in the 0.13-micron capable facility and will reach the full capacity of 30,000 8-inch wafers per month in 2002.

The company now offers leading-edge 0.25-, 0.22-, and 0.18-micron process technologies. More advanced technologies and RF capabilities will be available in the future.


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