February 12, 2001–San Jose, California–Toshiba America Electronic Corp. today announced that it has expanded its family of RF IC packages, known as Cell Packs. The new Cell Packs offer designers a quick and easy way to implement a variety of important functions required for Bluetooth-enabled devices and mobile communications products.
“Recognizing the need for smaller, more highly integrated RF components, the combination of functions available in our new Cell Packs can reduce the time-to-market for Bluetooth and other mobile communications enabled devices,” says Ed Monzon, senior business development manager, Microwave and RF Devices, TAEC. “By incorporating the necessary components including amplifiers, crystal oscillators, and SPDT switches, we are able to provide OEMs with a one-stop-shop for their RF design requirements.”
Each RF Cell Pack eliminates the need for multiple discrete devices required to perform specific functions such as wideband amplifier, mixer, attenuator, and single-pole double-throw (SPDT) switch. The extended family now includes three-wideband amplifier Cell Packs for low voltage operation, as well as Cell Packs for crystal oscillator and SPDT switch functions.