Unitive plans worldwide wafer level bumping and flip chip facilities

Research Triangle Park, North Carolina–Unitive Inc., a provider of outsourced advanced semiconductor packaging technologies, has closed a $30 million round of equity financing led by Onex Corp. and now plans to build and acquire state-of-the-art wafer level bumping and flip chip fabrication facilities throughout the U.S., Europe, and Asia.

Strategic investors participating in the financing round include Celestica Inc.; Conexant Systems, Inc; Fairchild Semiconductor International, Inc.; Flextronics International Ltd; and Onex Corp. Unitive has also secured $14 million of debt financing for the purchase of capital equipment.

During 2001, Unitive plans to build a facility in the western U.S. capable of bumping up to 400,000 wafers per year. “We look forward to this opportunity for expansion into the western U.S.,” says Robert Lanzone, one of Unitive’s vice presidents. “The new facility will support the expected increase in demand for advanced interconnect solutions and will complement Unitive’s North Carolina and Taiwanese operations.”


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