Infineon introduces leadless package for discrete semiconductors

March 7, 2001–Munich, Germany–Infineon Technologies AG, one of the leading suppliers of radio frequency (RF) and audio frequency (AF) discrete semiconductors to the communication industry, today introduced a revolutionary packaging technology. The thin, small, leadless package (TSLP) represents a milestone in size, performance, and package innovation, meeting market demands for smaller components in a broad range of wireless and portable products.

Superior chip-scale packaging concepts and leading-edge manufacturing processes enabled Infineon to come up with an innovative plastic lead-less package for discrete devices that consumes only 20% the space of a standard SC-75 package. With an overall footprint of only 1.0 x 0.6 x 0.4 cubic mm, the TSLP package is not just an ultra-miniature size package with a reduced soldering footprint, it marks also a significant height reduction compared to the widely used SC-79 package. The new TSLP is compatible with existing pick-and-place equipment and PCB insertion techniques.

Infineon offers a wide variety of diodes and transistors in this new TSLP-2/3 (2/3-pin). The new package is ideal for any space-saving or innovation-driven application like wireless systems, global system for mobile communications phones, personal digital assistance products (PDA), digital cameras, and portable digital audio/video players.

Due to their reduced parasitics, diodes and transistors using the TSLP show an improved frequency response. This is especially important for all devices working in the radio frequency band from 400MHz up to 2.5GHz where all major mobile communication and wireless Internet standards such as 2.5G and 3G are located.

Using efficient high-volume batch scale production and the elimination of ceramic substrates will have a positive impact on component cost. In addition, the new TSLP is a further contribution to Infineon’s efforts for environmental protection by applying ecologically beneficial materials. With its lead-free and halogen-free components Infineon’s TSLP fulfills all criteria for a “green” package.

High-volume production of devices using the TSLP will commence in April 2001. Future chip scale plans based on innovative TSLP concept also include dual diodes, dual transistors, and small scale integrated semiconductors for various applications.


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