Kimball International opens microelectronics facility in California

March 14, 2001–Jasper, Indiana–Kimball International, Inc. today announced the opening of its new 40,000-sq.-ft. microelectronics facility in Valencia, CA. As Kimball Electronics Group’s (KEG) Microelectronics Center of Excellence, the facility will support wafer and die processing, design and manufacturing of standard and custom monolithic devices, multi-chip modules (MCM’s), chip-on-board (COB), and surface mount (SMT) assemblies.

“Our microelectronics capability plays an important role in providing advanced packaging technologies to support our customers’ requirements,” says Don Charron, president of Kimball Electronics Group.

Kimball International’s Electronic Contract Assemblies business segment provides design engineering, manufacturing, packaging, and distribution of electronic assemblies, circuit boards, multi-chip modules, and semiconductor components on a contract basis to a variety of industries on a global scale.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.