Amkor to expand development of 3D IC packages

April 5, 2001 – West Chester, PA – Amkor Technology is expanding its development and qualification of 3D IC packages in order to reduce production costs and handling time. 3D or stacked ICs also require less space, have higher reliability and better electrical performance than the combination of devices they replace, the company said.

The company’s 3D packaging options include die stacked three- or more high, stacked die of the same or different sizes and side-by-side 3D die stacks. 3D assembly techniques allow interconnect technologies to be combined within the package, according to Amkor.

Another advantage of 3D packaging, the company said, was that stacked die reduce the length of interconnects between the devices, providing better performance. Moreover, 3D packages only require a single substrate, while individually packaged ICs each require its own high-density interconnect substrate.

Since 1999, Amkor has been shipping 3D IC packages used in cellular phones, routers, switches and other emerging technologies.

For the year 2001, 3D package volumes will climb to 230 million units, according to analyst Tech Search International. The firm expects a 50% market growth to 348 million by the end of 2002 for all applications.