April 16, 2001 — TSUKUBA — A dozen chip and electronic companies have united to jointly develop next-generation semiconductor technologies.
The five-year, $675 million research and development project is designed to develop high end materials and technology needed to make chips below 0.1 microns, according to a published report in the Korea Times. The program is known as Advanced Semiconductors through Collaborative Achievement.
Samsung Electronics, Fujitsu, Hitachi, Matsushita Electric Industrial, Mitsubishi Electric, NEC, Oki Electric Industrial, Rohm, Sanyo Electric, Sharp, Sony and Toshiba have all signed on for the project.
A cleanroom facility will be constructed for the project, which will be based in Tsukuba research and university community just outside of Tokyo. The completion of a 70-nanometer technology module is slated for 2005.