Infineon set to equip German 300mm fab

April 23, 2001 – Dresden, Germany – Infineon Technologies said it is ready to equip the 300mm production module for memory products that the firm started building in cooperation with Motorola last spring.

Equipment will now be brought into the completed module for installation. When work is completed, total investment volume in the new module will amount to approximately Euro 1.1 billion. Infineon claims the new fab will deploy the 300mm technology for the first time anywhere in the world.

The new module is planned to reach full capacity toward the end of the year 2002. During the start-up phase, 256-Mbit DRAM storage modules in 0.14-micron structures will be produced. Infineon will introduce and manufacture other products on the basis of its technology roadmap.

Infineon developed the 300-mm technology in Dresden in cooperation with Motorola in a joint venture known as “Semiconductor300”. The Free State of Saxony and the German National Ministry for Education and Research (BMBF) funded the project. The production and development activities in 300-mm technology have been brought together in the company known as Infineon Technologies SC300 GmbH & Co. KG.

With the start of volume production, approximately 1,100 new jobs will be created. The first products based on 300-mm silicon wafers are expected to roll off the new production lines during the second half of this year.


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