April 24, 2001 — DRESDEN, Germany — Infineon Technologies officials say the company’s 300-mm production cleanroom for memory products, located in Dresden, is ‘ready for equipment.’

Construction work on the facility, which will specialize in memory products, began in May 2000. Production equipment will now be brought into the completed cleanroom for installation. When work is completed, total investment in the module will exceed $984 million. The new Infineon fab will deploy the 300 mm technology for the first time anywhere in the world.

“Our significant lead in the field of 300 mm technology is certain to provide Infineon with an impressive advantage in terms of cost savings in the production of semiconductors,” said Dr. Johann Harter, senior vice president Frontends MP Group & managing director Infineon Technologies Dresden.

The new module is planned to reach full capacity toward the end of the year 2002. During the start-up phase, 256-Mbit DRAM storage modules in 0.14 um structures will be produced.

Approximately 1,100 new jobs will be created with the start of volume production. The first products based on 300-mm silicon wafers are expected to roll off the new production lines during the second half of the year.