Intel Completes Chip Using Advanced 0.13 Micron, Technology

April 3, 2001 — HILLSBORO, OR — Intel Corp. has produced its first silicon chips from its 0.13 micron technology, 300 mm wafer fab. The facility boasts a 135,000 square foot cleanroom, which is larger than many production facilities in the industry.

The factory, D1C, is the fist in the industry to produce the computer chips using advanced 0.133 micron process on the larger 300 mm wafers. Intel hopes to introduce chips built on the technology at the beginning of next year.

“For Intel, this accomplishment represents the beginning of a new era in cost-effective, high-volume manufacturing. For our customer, it means great products, great technology and increased availability in the future,” said Sunlin Chou, senior vice president and general manager of Intel’s Technology and Manufacturing Group.

Chips produced on 300 mm wafers are expected to cost 30 percent less than those made using smaller wafers. Larger wafers provide more than twice the surface area of 200 mm wafers and reduce the use of resource and wasted materials.

According to Intel statistics, 300 mm wafer manufacturing will use 40 percent less energy and water per chip than a 200 mm wafer factory on a production unit basis.


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