National Scientific, UMC team up for WLAN development

April 16, 2001 – National Scientific Corporation, Phoenix, AZ, and United Microelectronics Corp., Taiwan, today announced they are aligning to gain the capacity required for manufacturing a new family of wireless products that target the requirements of the wireless local area network industry.

The first silicon is scheduled to tape out on UMC’s 0.25-micron RFCMOS process in June. NSC is producing wireless transceivers for communication applications that require lower power consumption, simpler design, and smaller die size.


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