April 27, 2001 – Kyoto, Japan – Dainippon Screen Mfg. Co. Ltd. (DNS) has demonstrated uniform 300mm wafer coatings using less than 1 milliliter of Dow Chemical’s SiLK semiconductor dielectric resin.
DNS reports that this demonstration has established a new benchmark in 300mm wafer coating results which will significantly reduce Cost-of-Ownership (COO) for low-k Spin-On Dielectric (SOD) materials.
The company reported that in order to succeed in reducing SiLK consumption, it applied its proprietary Variable Pre-Spin Plus (VPS+) coating technology already used in volume production for photolithography resist wafer coating.
Dow Chemical estimates that this breakthrough deposition technology, in combination with its 300mm SiLK resin formulations, will reduce the overall COO by 35% from the previous benchmark.
DNS expects to formally announce the 300mm wafer SOC track before the upcoming IEEE International Interconnect Technology Conference in June.