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Solid State Air Conditioners
A new line of thermoelectric/solid state air conditioners provides a broad range of thermoelectric cooling and heating protection in laser-based systems, scientific instruments and computer control packages for industrial and military applications. The systems are available in 400, 800 and 1500 BTU/HR sizes and reportedly feature reliable performance at high temperatures, compact size, vertical or horizontal mounting, low acoustic noise, low power requirements, NEMA 12 and 4X configurations, and the ability to withstand shock and vibration in mobile applications. Electrografics International Corp., Warminster, Pa.
SOI Wafer Inspection
The AW-2000 is an automated system that creates images through bonded SOI wafer pairs to locate voids, microvoids and other internal defects. The system is based on Sonoscan's C-SAM acoustic micro-imaging technology and uses a robot arm to remove a wafer from an incoming cassette, positioning the wafer for acoustic imaging. The ultrasonic transducer reportedly detects microvoids as small as 5 microns in diameter. Wafers up to 8 inches in diameter can be handled by the system, which finds defects in wafer pairs joined by direct bonding, glass frit bonding and epoxy bonding. After acoustic imaging, system software classifies each wafer according to the user's requirements, and the robotic arm places the wafer in the appropriate outgoing cassette. Stored data contains the information needed to apply accept/reject criteria to individual devices after dicing. AW-2000 inspection can be performed after initial bonding, annealing or thinning. After metallization has been deposited, the acoustic image is typically overlaid with a wafer map to relate local defects to specific devices on the wafer. Sonoscan Inc., Elk Grove Village, Ill.
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AOI Monitoring Tool
The MVP CIMCIS Dynamic Process Control is an error measurement, inspection and feedback system that collects data from boards in process and lets operators take immediate, correction active whenever any segment of line performance drops below preset limits. When coupled with MVP's high-speed AutoInspector Series of AOI systems, Dynamic Process Control reportedly gives user the ability to monitor and optimize pick-and-place systems, feeders and nozzles, resulting in tightly controlled process variability, higher first pass yields and improved quality. Real-time data collected by the AutoInspector are captured and archived in a CIMCIS “open” SQL database. With the addition of a Web browser feature, in-depth process information can be accessed and instructions can be sent to particular machines from anywhere via the Internet. Machine Vision Products (MVP) Inc., Carlsbad, Calif.
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Soldering Iron Technology
SmartHeat technology is said to ensure consistent soldering iron tip temperature under a wide variety of thermal loads, and accommodates lead-free soldering without need of modification. Iron heat is not “stored” in the soldering iron tip, but applied directly from the heater to the joint. If the tip cools while transferring heat to a joint, the tip cartridge instantly responds by increasing power to restore tip temperature. Tip temperature is self-regulated to within ± 1°C of a set point, regardless of thermal load. Metcal Inc., Menlo Park, Calif.
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Image Processing Software
The FIP-600NT image processing workstation offers a comprehensive range of operators (show as on-screen icons) that can be custom-tailored for individual customers. The software features instant and automatic real-time adjustment of all image processing functions and permanently optimized noise reduction for all inspection tasks. The software is compatible with most standard networks, but can also be custom designed to facilitate specific user interface requirements. The software is equipped with pseudo-color display for background images, as well as a number of different filters including difference and smoothing, edge, and edge-extraction. An integrated plug-and-play module facilitates high-speed filter selection. FIP-600NT operates under Windows NT, is compatible with all Microsoft Office programs and is also available as a standalone image processing system for use with other X-ray inspection systems. Feinfocus USA Inc., Stamford, Conn.
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Benchtop Ionizer
The ZVI5100 benchtop zero volt ionizer eliminates static charges on non-conductive materials and isolated conductors. Features include reduced air velocity with increased coverage, no sacrifice of decay time, user-programmable maintenance and alarm levels, and data output. The small, compact single-fan ionizer features Steady State DC ionization and patented Sense Feedback balancing. The automatic balancing of the ionization system is said to maximize uptime, optimize output and compensate for emitter point contamination, humidity changes and other conditions that might affect balance at the work surface. The ionizer is reportedly ideal for applications where high air velocity is detrimental to the process, such as gold wire bonding, surface mount areas and MR head manufacturing. Semtronics, Garden Grove, Calif.
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Silver Epoxy
921M01 is a thin solvent-free conductive adhesive that has a variety of cure schedules, as low as 60°C. The product is said to have a work life of more than two days. It can be packaged in Tra-Con's bipax to ensure that the properties are maintained in an easy-to-use pre-measured bipax suited for large-scale or small applications. The product is also available in pre-mixed or frozen syringes for automated systems. This silver epoxy is said to be ideal for painting and screen printing onto a variety of surfaces, offering good adhesive strength. Tra-Con Inc., a National Starch & Chemical Co., Bedford, Mass.
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Magnet Stepper Motor
The series 44M100D high-torque 44-mm magnet stepper motor is said to be powerful, precise, quiet and lightweight (2.2 oz). Applications include electronic component delivery systems, such as SMT tape and label feeders, and precision testing instrumentation. The 3.6° step angle motor (100 steps per revolution) measures 1.7 x 0.48 inches. Available in bipolar version only, the motor produces 30mNm pull-out torque at 150 pps when driven with a chopper drive. Permanently lubricated sleeve bearings are standard. Thomson Industries Inc., Port Washington, N.Y.
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De-taping Machine
The Model 249 de-taping machine is designed for rapid removal of surface mount technology components from Electrical Industries Alliance (EIA) embossed tape. The machine accommodates tapes between 8 and 44-mm wide, and removes ICs from reels and transfers them into tubes that are then ready for assembly and other production processes. The machine is said to eliminate incorrect orientation and lead defect errors that are created by handling devices during manual de-taping. The Model 249 reportedly has a throughput of up to 6,000 units per hour. After a reel is attached, a short section of cover tape is separated from the carrier tape, and the leading carrier tape edge is fed into the chip removal channel. Empty tapes are routed to exit channels for easy disposal, while removed ICs are loaded into tubes. The unit permits several application-specific settings and adjustments, including carrier tape feed speed, unit counting (increment or decrement), gap sensor sensitivity, shutdown timer, audible feedback (on/off) and password function. Speedline Manufacturing Co., Springfield, Pa.
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Fiber Optic Sensor
The D10 Expert is a high-performance fiber optic sensor that features dual output channels with independently configurable set- points that enable it to solve challenging applications, with as little as 1-percent contrast. The sensor's 16-bit microprocessor and Teach mode programming are said to deliver 12-bit A/D resolution within a 300-mm (12-inch) range. The sensor is available with a choice of dual discrete outputs or a single discrete output paired with a single 0-10V dc voltage analog output, and can be used to replace several other sensing devices. Analog output models feature Auto-Span scalable output that distributes the analog output signal over the width of the programmed sensing window automatically to provide a continuous, consistent response. Banner Engineering Corp., Minneapolis, Minn.
Eutectic Preform Feeder
MRSI Group is now addressing the problem of presenting solder preforms for eutectic bonding by offering automatic preform feeding on the MRSI-505E. This perform feeder can handle reels of solder and cut a variety of preform sizes for immediate pick and place during the assembly process. Gold tin, gold germanium and other materials are fed as ribbon to the feeder, which uses a guillotine mechanism to cut the preform while it is held over a vacuum hole for positive location by the pick-and-place tool. The process is optimized by programming the cam-driven blade and the stepper motor for control of indexing. The feeder presents the preforms at the same height as normal tool movements to achieve high cycle rates. MRSI Group, North Billerica, Mass.
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Spot Curing System
The EFOS Novacure IR is a new infrared light spot curing system for inline curing of thermal epoxies. The system is said to offer all the benefits of inline spot curing, using conventional heat cure adhesives, for a broad range of fiber optic and electronic component manufacturing processes. Features, such as built-in system intelligence, and patented thermal sensing and reporting, are said to deliver levels of precision, control and repeatability that are not possible with thermal batch curing. Infrared light is delivered from a 150-watt proprietary quartz halogen bulb (at wavelengths from 0.7 to 4.5 microns) and focused only in the needed area. StepCure software allows an operator to tailor the cure profile to optimize the performance of a particular material. In the closed-loop feedback mode, data from the non-contact temperature sensor can be used to automatically adjust lamp output.
EFOS Inc., Mississauga, Ontario.
Machine Vision System
The upgraded EZVision 12X complete machine vision system for general purpose PC-based inspection is now available in Windows NT and includes advanced features, such as robot guidance, pattern matching, optical character verification and SPC data collection. The complete product includes the processor, software, operator interface, camera, lens, light and initial inspection setup routine prior to shipment. On-site training, installation assistance and turnkey automated inspection stations are also available. Cincinnati Industrial Automation Ltd., Covington, Ky.
Die Attach Epoxy
The Epo-Tek H20E is a thermally conductive die attach epoxy with a reported conductivity as great as 29 W/m°K, demonstrating that the product is comparable to solder and eutectic alloys. The adhesive is said to be ideal for applications that require heat dissipation, and has passed the 85°C/85% RH for 1,000 hours and its thermal resistance has tested superior to other adhesives and similar to eutectic: H20E = 0.9°C/W and eutectic = 1.0. The product is compatible with a variety of substrates, such as FR4, ceramics, leadframes and flex substrates, such as Kapton, Mylar and polyester. Epoxy Technology Inc., Billerica, Mass.
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Radiation Hardened MOSFET
The IRHY7G30SE RAD-Hard power MOSFET is said to improve power management circuits and high-frequency switching systems by minimizing component count. The product is an enhancement-mode N-channel device, made with International Rectifier's proprietary radiation-hardened gate- and field-oxidation process to achieve stringent single-event upset and total ionizing dose hardness requirements. The device is single event effect hardened with linear energy transfer of 37 MeV. The device retains nearly identical electrical performance up to 100 Krads total dose. The product is available in standard JEDEC Solid State Technology Association TO-205AF (TO-39), TO-254AA and TO-257AA packages, as well as customer-specified packages. International Rectifier Corp., El Segundo, Calif.
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Piezoelectric Accelerometers
Models 515 and 518 low-cost miniature piezoelectric accelerometers are configured in TO-5 and TO-8 packages, respectively. Output for the Model 515 is 10 pC/g, and 100 pC/g for the Model 518. Amplitude response is 0.05 to 12,000 Hz for the Model 515, and 1 to 7,000 Hz for the Model 518. These accelerometers are designed to provide high-performance integrated vibration measurement of machines, structures, vehicles and other high-volume OEM applications. The device is designed for integration in standard hybrid or SMT electronics packaging and may be mounted by either adhesive or soldering. Both models are hermetically sealed and capable of providing long-term reliability in harsh environments. Operating temperature is -55 to 150°C. Sinusoidal vibration limit is ±500 g's pk, while shock limit is 10,000 g's pk. Weight is 0.10 oz for the Model 515, and 0.88 oz for the Model 518. Endevco Corp., San Juan Capistrano, Calif.
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Assembly Cell
The Model 3500-II RF component amplifier assembly cell for precision placement of adjacent die and steady-state heat eutectic processing is said to employ a temperature control system that allows for eutectic bonding of adjacent die in RF packages. For faster presentation, preheat mesas (hot rails) are available. The assembly cell can be integrated into an in-line automation system with cassette-to-cassette handling. The cell's eight-position turret head allows fast, precision alignment and calibration, including theta, for up to eight vacuum tools. The cell accommodates large components and die as small as 7.0 mil. Components larger than 2 x 2 inches can be transferred from the input tray to the eutectic heater stage for assembly. Palomar Technologies, Vista, Calif.
Electroplated Solder Bumps
Unitive Advanced Semiconductor Packaging now offers prototyping of its lead-free solder and low-alpha, lead-free solder. Unitive's process for electroplating tin-silver alloy on semiconductor wafers is said to offer cost savings when compared to the traditional lead-tin alloy solder. The alloy used contains 3.5 percent silver and has a melting point of 221°C. When soldered to a copper pad, copper is incorporated in the solder bump and results in a 96-percent tin, 3.5-percent silver, 0.5-percent copper ternary eutectic solder bump. Unitive Advanced Semiconductor Packaging, Research Triangle Park, N.C.
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Ceramic Packages
The SE50 line of standard off-the-shelf designs handles packages operating between DC and 50+ GHz. These commercial packages can withstand the heavy electrical and thermal demands required to protect the broadband and power MMIC amplifiers needed for LMDS, point-to-point, and point-to-multipoint technologies. The packages have a standard copper laminate base and a patented microstrip-imbedded microstrip-microstrip transition design. The 0.390 x 0.330-inch package has a cavity length of 0.200 x 0.140 inch. StratEdge, San Diego, Calif.
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Thermal Interface Material
Polarchip thermal interface material is a highly compressible, thermally conductive material that is said to be ideal for filling the undesirable gaps between heat-generating devices on printed circuit boards and the heat sinks, heat spreaders and metal chassis that are used to dissipate the heat. Polarchip is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene matrix filled with boron nitride particles. The low elastic modulus of the matrix imparts softness, conformability and compressibility to the composite, while the high thermal conductivity of the boron nitride gives the composite its good thermal transport characteristics. W.L. Gore & Associates, Inc., Newark, Del.
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Potting Compound
Formceram C442 is a 3,000°F ceramic potting compound. It is a rigid chemical resistance cement that is said to provide good protection and high security for a circuit. Fine-grain aluminum oxide has high temperature resistance, high heat conduction and good dielectric strength, and can be in direct contact with heating elements. It is a simple water mix cement that flows easily then sets up rock hard. The product is reportedly suited for sensors, temperature probes and accelerometers where high conductivity and rigidity yield a more rapid response. Hottec Inc., Norwich, Conn.
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100kV X-ray System
The 100kV pcba/inspector is a high-resolution microfocus X-ray system dedicated to the inspection of printed circuit board assemblies to detect manufacturing errors, such as missing balls on BGAs, voiding and shorts. The system provides total quality management for inspection and verification of boards using BGAs, flip chips, µBGAs and other high-density packages. The X-ray source is said to detect details as low as 4 microns. The chamber can scan boards up to 18 x 24 inches and can view real-time images from all angles with an optional large capacity tilt axis up to ±45 degrees. Phoenix X-ray Systems and Services Inc., Camarillo, Calif.
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