TSMC touts 300mm pilot for 0.13m

April 19, 2001 – Hsinchu, Taiwan – Taiwan Semiconductor Manufacturing Company has announced what it claims are two foundry firsts for advanced technology development.

TSMC said that early this month, it became the first foundry to complete a 300mm pilot lot for 0.13?m, all-copper process of a 4Mb SRAM test vehicle and with a demonstrated reasonably good yield. Following the pilot, TSMC plans to test a few customers’ 0.13?m products. In addition, TSMC has completed its basic modules for 0.10?m technology, which allows TSMC the flexibility to ally with its first tier customers on 0.10?m technology process alignment to benefit both in terms of improved competitiveness.


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