April 12, 2001 – Singapore – UMC held a groundbreaking ceremony today for the new 300-mm fab of its new Singapore affiliate company, UMCi Pte Ltd.
The production schedule of the fab was postponed by a year from UMC’s earlier estimates. Plans are now to have a production run in 2003, with the focus on large die-size system-on-chip units using UMC’s 0.13-micron and 0.10-micron copper/low-k process technologies.
The groundbreaking was hosted by UMC Group chairman Robert Tsao and attended by Singapore Minister for Trade and Industry, Brigadier-General George Yeo.
Investment in the facility is expected to reach $3.6 billion, according to the company. Construction will be in two phases, with a total capacity of 40,000 wafers/month. UMCi Pte Ltd is a joint venture between UMC, Infineon Technologies and Singapore’s Economic Development Board Investments Pte Ltd (EDBI).