UMC unveils new logic process option

April 16, 2001 – Sunnyvale, CA – UMC announced today that its foundry now offers a process to combine high-speed and low-power logic transistors into one design.

UMC uses its WorldLogic SOC platform for the new design to leverage the foundry process that successfully integrates a true low-k dielectric material at the 0.14-micron generation. The new logic process option, called Fusion, addresses the next-generation semiconductor products with the flexibility to simultaneously meet the most demanding power budgets, according to the company.


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