Thermosonic Bonding
The Model 410 flip chip bonder can now be ordered equipped with thermosonic bonding capability that satisfies a range of applications, including small microwave and optical devices, and large devices with substantial bump counts requiring high bond loads. In the case of fragile surface acoustic wave devices, where gold or indium phosphate is used as the bonding material and there are 20 or less bumps, the Model 410 can be equipped to heat the substrate to between 100 and 175°C with the pick-up tool holding the device applying vibration and ultrasonics at about 60 kHz to achieve a strong intermolecular bond. The new thermosonic bonding capability is also suitable for die having bump counts of 30 or higher. For microwave devices using gold-gold interconnections, the system's new capability for applying mechanical pressure, a horizontal wiping action, ultrasonics and heat can be used to form the bond. Semiconductor Equipment Corp., Moorpark, Calif.
Data Exchange Software
PolyDyne Software has introduced iXchange, a Web-based architecture that companies can use to prepare, analyze and distribute procurement data. iXchange is comprised of DesignWin for original equipment manufacturers, QuoteWin for contract manufacturers and SupplyWin for suppliers, and reportedly allows RQFs, BOMs and POs to be exchanged in seconds. The software works off of a Java-based client and is said to work well with MRP, ERP and legacy systems, allowing easy and fast integration into existing IT infrastructure. PolyDyne Software, Austin, Texas.
Tactile Sensor
The Topaq Pressure Analysis System is used in conjunction with Pressurex/Fuji Prescale stress indicating films and reportedly provides a unique perspective of the distribution and actual magnitude (PSI) of pressure between any contacting or impacting surfaces. Pressurex films instantly and permanently change color in response to the amount of pressure applied to them. Topaq scans and interprets the exposed film and produces digitally enhanced images and statistical reports. Features include histograms of pressure levels, enlargement and reduction capabilities, pseudo-color and 3-D viewing modes, and extensive smoothing, filtering and thresholding. The system is comprised of a scanner, software, technical support and documentation. Sensor Products Inc., East Hanover, N.J.
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Chip Capacitor Arrays
The multilayer chip capacitor (MLCC) array series integrates the functionality of up to four individual chip capacitors into a single component. The arrays are available in 0603, 0805 and 1206 case sizes with X5R or Y5V temperature ratings. Designed for EMI/RFI noise mitigation, smoothing and bypass (decoupling) applications, the MLCC array components are said to reduce PCB real estate needs by as much as 30 percent and onboard component counts by up to 75 percent. Taiyo Yuden USA Inc., Schaumburg, Ill.
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High-temperature Tape
Scapa 558 is a high-performance pressure-sensitive silicone adhesive film designed to mask and protect gold finger contacts on printed circuit boards during high-temperature wave soldering and hot air leveling processes. The heat-resistant polyimide film is said to eliminate PCB degradation that can result from electrostatic discharge. Scapa 558 is thin and conformable, and can mask uneven surfaces. The adhesive can withstand operating temperature up to 500°F, and removes cleanly. The polyimide backing reportedly provides good puncture, tear and abrasion resistance, and is impervious to chemicals. Scapa Tapes North America, Windsor, Conn.
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BGA Stencils
Flextac stencils are self-sticking, laser cut, polymer solder paste stencils that use a residue-free adhesive to seal around BGA pads to ensure that solder paste does not bleed under the stencil when paste is applied. Flextac stencils are laser cut from anti-static polymer film that is the same thickness as metal stencils. The stencils can be removed and repositioned, and side tabs serve as solder dams, preventing overspill. No external taping or fixturing is necessary to hold the stencils in place. Although the stencils are disposable, they reportedly can be used several times. Circuit Technology Center Inc., Haverhill, Mass.
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Radial Bristle Discs
For use in cleaning, deburring or finishing irregular shaped metals parts, 3M's new radial bristle discs are available in two- and three-inch diameters. The discs are constructed with abrasive filled bristles and are said to provide long life and be flexible enough to get into tight spots. They leave a variety of finishes, from satin to mirror polish, and have reportedly proven more effective at coatings removal than industrial nylon or wire brushes. The discs are rated for a maximum operating speed of 20,000 rpm (three inch) and 30,000 rpm (two inch), and work on many different tools and use a standard mandrel. 3M, St. Paul, Minn.
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Curing Plate
The SCS drying/curing hot plate is designed to cure photoresists, epoxies and other thermally-cured or solvent-based materials applied to flat substrates, such as spin-coated wafers. The plate can be set to any temperature between 50 and 150°C, and maintains the selected level with an accuracy of ± 1 percent across the working surface. It is operated with a single control, and a four-digit LED display shows the temperature in either Celsius or Fahrenheit. A vacuum hold-down feature ensures close contact between coated substrates and the heating plate for efficient and even heat transfer. Specialty Coating Systems, a division of Speedline Technologies, Indianapolis, Ind.
Cost Model Software
Cost Model 4.0 software is said to accurately and easily determine the cost of integrated circuits, for use when negotiating new products from foundries or for determining the potential price of a new custom circuit. The software reportedly can accurately model devices as small as 0.13 microns using up to 36 masking steps. Users can view wafer, die and packaging costs as inputs change. The software recently has been updated and is capable of forecasting 300-mm wafer processing costs, high-count metal levels costs and additional costs associated with SOI and EPI wafers. Integrated Circuit Engineering, Scottsdale, Ariz.
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Flexible Assembler
The KE-2020 is a high-speed flexible assembler designed to place small and odd-shaped components, as well as standard components, at optimum speed. The assembler is equipped with a high-speed four-nozzle head and has one fine-pitch placement head with one nozzle capable of placing 0201 components, microBGAs, CSPs and other odd-shaped components. The KE-2020 features a multi-nozzle laser align with inflight centering, which allows for faster cycle time and accuracy. The vision system inspects for the presence and condition of balls and prevents faulty balls from entering production. The fine-pitch head is said to be capable of placing up to 1,800 components per hour, while the multi-nozzle head places up to 11,000 components. Juki Automation Systems Inc., Morrisville, N.C.
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Curing Oven
The Horizontal Pro is designed for curing and drying of components and PCBs in magazines or piece-by-piece. The modular concept of the oven allows a variable number of heat zones from five to 12, and also one or two cooling zones. Single- or double-lane conveyors can be specified according to needs. Curing times vary from four to 120 minutes, depending on the number of zones and the selected conveyor speed, and process temperatures can go up to 250°C. The maximum dimensions of the work pieces are 250 x 350 x 200 mm. The oven is designed for inline curing in existing production lines. Lükon Paul Lüscher Werke AG, Tãuffelen, Switzerland.
Inspection and Handling System
The ST-68 tape-and-reel system offers automated taping and vision inspection for a full range of two-side devices. The system features RVSI's AVS-4000 vision system, which enables it to fully inspect devices at maximum production speeds. The vision system uses a digital CCD camera with multiple light sources to inspect devices for orientation, mark and lead integrity. The system is said to provide 3-D measurement of lead and average plane coplanarity, terminal dimension, true position span and spread error, pitch, width and standoff. Throughput rates are said to be as high as 6,800 units per hour for 0.150-inch SOIC-8 devices with full vision inspection. The ST-68 also features a two-category device-reject area. A stepper-controlled pick-and-place head sorts rejected devices based on failure criteria. Options include a second camera, mounted above the tape; a programmable light source for advanced inspection applications; level-wound tape input; and custom-designed, application-specific tooling. Robotic Vision Systems Inc. (RVSI), Canton, Mass.
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Wire Bond AOI
The Viscom 6053BO performs automated optical inspection for wire bonding, reportedly allowing users to boost wire bond inspection speed to 100 percent in-line. High-resolution cameras capture digital images of bond wires and connections, and then analyze them for defects. Analysis software automatically recognizes a range of bonding defects, from coarse faults (such as detached bond connections) to possible shorts in bond wires. A dual-axis gantry system moves the sensor head over the inspection target. Module resolution is application-oriented and starts at 3.5 microns. Between two and eight sensor modules may be mounted in a sensor head, depending on desired throughput rate. Higher throughputs can be achieved by cascading multiple modular units in succession. Viscom USA, Atlanta, Ga.
Dielectric Resins
A range of high-performance dielectric polyurethane and epoxy resins from Axson North America is designed to protect electronic and electric systems or components against vibration, electromagnetic fields, dust and other sources of damage. These resins are said to be well-suited for all dielectric applications, but are particularly useful in the encapsulation of on-board electronics systems for the automotive, rapid transit, sport vehicle and aerospace industries. RE 11880 flexible polyurethane resins withstand thermal shock from -40 to 271°F, and RE 22946 is a fire-resistant resin with a thermal conductivity of 4.5 BTU/hr/ft F (2.6 W/mK). Axson North America, Eaton Rapids, Mich.
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PCB Overmolding
PolyTect Soft Molding is an engineering grade polymer for overmolding fully populated printed circuit boards. The product is said to allow for a one-step process that molds a single piece, replacing the typical application consisting of a two-piece plastic housing and conventional potting. The product reportedly will not degrade components, and can be molded into intricate shapes with screw holes and mounting bosses. The material has a molding temperature and internal mold pressure of 150°C/600 psi. The finished molding unit can withstand 185°C. AVX Corp., Myrtle Beach, S.C.
Plasma Cleaning System
The MultiTRAK system is a multi-strip in-line plasma cleaning system that enables IC packaging manufacturers to integrate a high throughput in-line plasma treatment system into BGA, CSP, flip chip, MCM, QFN and TSOP production lines. The system reportedly can process two to seven strips in less than one minute. The handling system's architecture allows for reconfiguration in the field, including changing the number of substrates being processed per run, as well as the dimensions of the substrates. The system can be used in-line or as a stand-alone unit. It can also be run in an island form-factor, to feed a designated line of equipment including die attach systems, wire bonders and encapsulation equipment. Features include a design for uniformity and reproducibility without limitation, regardless of magazine style, open vs. closed design, pitch or dimensions; SEMI S2-93 compliance, CE certification, SMEMA 1.2 compatibility and the option of GEM/SECS integration. March Plasma Systems, a subsidiary of Nordson Corp., Concord, Calif.
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Industrial Smart Camera
The ESPRI-C smart color solution is now offered for the VC65/C color industrial smart camera. With this option, the VC65/C is a stand-alone color vision system. Using multiple user-defined colors and regions of interest, the smart cameras can inspect or verify colors on several different items, whether stationary or in motion. Individual tolerances can be specified for color (hue), saturation and brightness (intensity). Capable of measuring up to 400 pieces per minute, the VC65/C can be used during on-line operations. The product includes 8 MB of RAM, 3 MB of Flash EPROM, a CCD sensor that provides 800 x 600 RGB pixels, shutter speeds from 1/100,000 to 20 seconds, and a powerful DSP. Vision Components, Burlington, Mass.
