June 11, 2001 — ROUND ROCK, TX — DuPont Photomasks and Micron Technology plant to form a joint venture that will result in the creation of a new photomask cleanroom facility.

The two companies recently signed a non-binding memorandum of intent. Officials hope to sign a definitive agreement within two months. Under the proposed deal, a new photomask facility will be built neat Micron’s new semiconductor research fab and manufacturing campus in Boise, Idaho. The cleanroom is expected to open by the end of 2002.

Officials from DuPont say the move will allow them to better serve their customers.

“The value of mask technology gas increased dramatically since the semiconductor industry entered the deep sub-wavelength era at 0.18-micron and below. Our customers are expressing concern about the future capability and capacity for advanced mask technology, given rising complexity and costs,” said Peter Kirlin, chairman and CEO of DuPont Photomasks. “Our strategy as a world leader in advanced mask technologies is to structure agreements that best fit the needs of our customers.”

Engineers from both companies will work at the facility to develop advanced mask technologies including phase shift masks and masks using optical proximity correction.

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