June 28, 2001 — MILPITAS, CA — FlexICs, Inc. has opened its pilot fabrication plant for producing semiconductors on plastic. The 18,000 square foot facility features an ISO Class 5 (Class 100) cleanroom.
The company specializes in ultra low temperature semiconductor processing on plastic, a technology that officials say will facilitate next-generation PDAs, cellphones and notebook PCs. Specifically, the technology will be used for shatterproof, lightweight, thin and flexible displays.
Officials have high hopes for the new plant.
“The opening of our fabrication facility is an important milestone for the commercialization of our semiconductor-on-plastic technology and takes advantage of the rapid adoption of portable electronics in our daily lives,” said Magnun Ryde, chairman and CEO of FlexICs. “Our technology will enable these products to be lighter, more durable, and thinner. Consequently, we see the possibility of a major shift in the way humans interact with electronic devices coming.”