Mitsubishi Materials Silicon is starting production of 200mm and 300mm SOI wafers using IBM’s SIMOX technology. It plans to ship 300mm samples by the 2H02.
The company will use IBM’s Modified Low-Dose technology for improved layer uniformity and surface flatness. It will produce the SOI wafers using this technology at its plant in Noda, Chiba prefecture, Japan.
//Nikkei Micro Devices