K&S licenses Flip Chip Technologies’ wafer bumping technology to STATS

August 23, 2001 – Willow Grove, PA.- Kulicke & Soffa Industries Inc. announced that ST Assembly Test Services Ltd. (STATS) has signed a technology licensing agreement for wafer bumping technology with Flip Chip Technologies L.L.C. (FCT), which is wholly owned by K&S.

STATS will use FCT’s Flex-on-Cap (FOC) wafer bumping and redistribution (RDL) technologies to facilitate the manufacture of advanced flip chip devices as it continues with the expansion of its existing flip chip capabilities.

According to STATS CTO B.J. Han, “FCT’s wafer bumping and redistribution technologies have a demonstrated record in producing robust and inherently high yielding results. Bringing FCT’s technologies in-house completes STATS’ existing backend flip chip assembly process. STATS plans to take a leadership position by offering market leading capabilities, which we believe the FCT wafer bumping technology will provide.”

“Singapore has emerged as the wafer fabrication center of Southeast Asia,” says K&S VP Don R. May. “The partnership with STATS is a continuation of our strategy to proliferate FCT’s technology on a global basis.”

The FOC and RDL processes have been in production in Phoenix since 1997, and have been licensed by assembly subcontractors and integrated device manufacturers worldwide.


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