HD Microsystems Offers New Polyimides
WILMINGTON, DEL.
The HD-8001 is said to be capable of resolving 1-µm features in 3-µm cured films. With a photospeed of 180 mJ/cm2 and a develop time of 30 seconds, the product delivers PSB processing for wafer fabrication. It was engineered to provide thinner coatings to better accommodate thinner die sizes. The HD-8000 and HD-8001 can be processed in fabs running both I-line and deep UV resists. The products are offered with an NMP-free, edge bead remover to eliminate edge bead and keep the back side of the wafer clean. (August 9, 2001)
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