TSMC delivers first chips from 300mm fab

August 22, 2001 – Hsinchu, Taiwan – Taiwan Semiconductor Manufacturing Co (TSMC) has announced that its new plant using 300mm silicon wafers had delivered its first products to customers.

TSMC said its Fab 12 facility had delivered 300 fully functional 300mm wafers containing test chips and memory chips for customer Etron Technology .

Fab 12, with planned capacity of 25,000 wafers/month, is TSMC’s first plant using only 300mm production lines, though it has another plant making both 200 and 300mm wafers.

Earlier this year, TSMC cut its capital expenditure budget to $2.2 billion from an earlier forecast of $2.7 billion by eliminating expansion in virtually all 200mm plants, but has not budged on spending plans for 300mm capacity.


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