August 29, 2001 – Research Triangle Park, NC – Unitive Inc. and Amkor Technology announced the qualification of Unitive’s wafer bumping technology for use in Amkor’s flip chip product family.

Amkor qualified Unitive’s eutectic and high lead solder bump structures in packages ranging from its high density laminate based SuperFC to the smaller fcCSP offerings.

“Having successfully worked with Amkor for over a year in supplying electroplated high lead bumps, we are looking forward to expanding that relationship by beginning to support Amkor’s volume production,” said Bob Lanzone, VP of marketing for Unitive.

The relationship will provide Amkor with second source options for solder bumping, multi-level copper redistribution capability, and access to wafer level chip scale package capacity targeting specific customers.

“Amkor is aggressively growing its flip chip product services and customer base. Seamless relationships with key players in the value chain like Unitive support this objective and ultimately provide value to our customers,” said Richard Groover, Amkor’s VP of flip chip development.

Unitive’s Research Triangle Park, NC and Hsinchu, Taiwan facilities will provide high lead and eutectic solder bumping for Amkor. This global flexibility permits customer specific supply chain optimization, adds value, and provides additional validation of the growing maturity of flip chip manufacturing services in general, according to the companies.

Specifically, the Unitive Advanced Semiconductor Taiwan (UST) facility in Hsinchu now provides a qualified source of solder bumping for Amkor to support product flows originating in local foundries.

“Unitive and Amkor are working to create a streamlined logistics flow for customers who require Asian supply chains for the movement of their products,” said Lanzone. “UST’s location in Hsinchu is strategically situated close to the major wafer foundries and Amkor’s Taiwanese T1 facility, which enables efficient product flow from the fabs to the bumping facility, and on through assembly and test.”

Amkor’s relationship with UST provides it with opportunities for cost and cycle time reduction by locating bump manufacturing close to its assembly and test production lines.