Flextronics Semiconductor joins UMC’s ASICplus Program

October 10, 2001 – Sunnyvale, CA – Flextronics Semiconductor, a business unit of Flextronics, a global provider of operational services focused on delivering design, engineering, manufacturing and logistic solutions to branded technology companies, has reached an agreement to become a member of UMC’s ASICplus Program.

As a member of the program, Flextronics Semiconductor will be able to offer start-up companies and established OEMs seamless access to UMC’s process technologies.

“Flextronics is leveraging UMC’s fabs for the production of a portfolio of silicon devices that include IP such as Forward Error Correction (FEC) at OC-48, OC-192 and OC768 speeds,” stated Glen Wiley, VP and GM of Flextronics Semiconductor. “Access through the ASICplus program will also help us to deliver to market, in increasingly tight market windows, devices with high speed I/Os for emerging standards such as system packet interfaces, SPI-4, SPI-5, and those with proprietary interfaces for optimizating high speed networking applications.”

The ASICplus program was established to enable UMC and its fabless ASIC partners to offer comprehensive, front-to-back ASIC development capabilities from design initiation, manufacturing and testing, to packaging, according to the company. In particular, the ASICplus program provides its members with guaranteed access to UMC’s process technologies, including the 0.13-micron generation. Flextronics’ commitment to join the program stems from a long-standing relationship between the two companies that began in 1997. Since that time, the two companies have collaborated to supply technology to numerous customers worldwide.


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